Projects

Failure analysis:

Electronics manufacturing:


• Analysis of the oven temperature reflow profile (lead-free (Pb) technology)
• Solving the roughness and wetting problems of the soldered joints. Please click HERE for picture gallery.
• Moisture sensitive level analysis
• PCBs history failure analysis. Correct identification of the process or component root cause of failure
Benefits are:
• Save supplier/customer creditability
• Save cost (components and failed boards SCRAP, design costs, rework costs, retest costs)
• Save supplier engineering time
• Improved yield by improving process

Semiconductor devices manufacturing:


• Investigation of failure circumstances
• Handling of failure samples
• External visual inspection of package
• Evaluation of electrical characteristic
• Non-destructive internal analysis of packages
• Determining failure locations inside chips
• Physical analysis of chips
• Analysis and structural analysis technologies